Glue layers for the DWC3 driver only make sense on specific platforms.
Add dependencies so that they are not built where they aren't needed.
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: WingMan Kwok <w-kwok2@ti.com>
Signed-off-by: Jean Delvare <jdelvare@suse.de>
Signed-off-by: Felipe Balbi <balbi@ti.com>
config USB_DWC3_OMAP
tristate "Texas Instruments OMAP5 and similar Platforms"
- depends on EXTCON
+ depends on EXTCON && (ARCH_OMAP2PLUS || COMPILE_TEST)
default USB_DWC3
help
Some platforms from Texas Instruments like OMAP5, DRA7xxx and
config USB_DWC3_EXYNOS
tristate "Samsung Exynos Platform"
+ depends on ARCH_EXYNOS || COMPILE_TEST
default USB_DWC3
help
Recent Exynos5 SoCs ship with one DesignWare Core USB3 IP inside,
config USB_DWC3_KEYSTONE
tristate "Texas Instruments Keystone2 Platforms"
+ depends on ARCH_KEYSTONE || COMPILE_TEST
default USB_DWC3
help
Support of USB2/3 functionality in TI Keystone2 platforms.