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(parent: 768ddee) | patch
lpc32xx: devkit3250: add spl build support
authorVladimir Zapolskiy <vz@mleia.com>
Fri, 17 Jul 2015 22:47:11 +0000 (01:47 +0300)
committerTom Rini <trini@konsulko.com>
Thu, 13 Aug 2015 00:47:34 +0000 (20:47 -0400)
commite9b3ce3f7ebf1c0dd13bff799de854a7f2f905e1
tree6c92441dc7cd54b062d05af510a7684e75c3c2cftree | snapshot
parent768ddeeecf7c49f97b6299e37c02332eba031270commit | diff
lpc32xx: devkit3250: add spl build support

The change adds SPL build support to Timll DevKit3250 board, the
generated SPL image can be uploaded over UART5, JTAG or stored on
NAND. SPL is designed to load U-boot image from NAND.

All new NAND chip defines in board configuration are needed by
SPL NAND "simple" framework, the framework is used to reduce
potentially duplicated code from LPC32xx SLC NAND driver.

Signed-off-by: Vladimir Zapolskiy <vz@mleia.com>
arch/arm/Kconfig diff | blob | history
board/timll/devkit3250/Makefile diff | blob | history
board/timll/devkit3250/devkit3250_spl.c [new file with mode: 0644] blob
configs/devkit3250_defconfig diff | blob | history
include/configs/devkit3250.h diff | blob | history
Broadcom-s U-Boot